Epoxy Technology / Material reference
EpoxyEPO-TEK® MED-353NDP
EPO-TEK® MED-353NDP is listed by Epoxy Technology as an epoxy adhesive / resin system. This record connects 22 reported fields with 2 manufacturer document links. Review the original technical data sheet for the applicable test conditions and processing instructions.
TwoManufacturer-reported
10 : 1Manufacturer-reported
Bulk - Part A: 1.20, Part B: 1.02Manufacturer-reported
Bulk: ≤3 Hours, Syringe: ≤2 HoursManufacturer-reported
One year at room temperatureManufacturer-reported
Part A: Clear, Part B: AmberManufacturer-reported
Technical & safety documents
2 linksFiles open on the manufacturer's document host. Region and language follow the source listing; confirm the revision inside the file.
EPO-TEK® MED-353NDP SDSEnglish · Not specified
Open file EPO-TEK® MED-353NDPEnglish · Not specified
Open file Reported specifications
22 fieldsMaterial and processing data
| Property | Reported value | Evidence |
|---|---|---|
| No. of Components | Two | Technical data sheet · p. 1 |
| Mix Ratio by Weight | 10 : 1 | Technical data sheet · p. 1 |
| Specific Gravity | Bulk - Part A: 1.20, Part B: 1.02 | Technical data sheet · p. 1 |
| Pot Life | Bulk: ≤3 Hours, Syringe: ≤2 Hours | Technical data sheet · p. 1 |
| Shelf Life- Bulk | One year at room temperature | Technical data sheet · p. 1 |
| Color (before cure) | Part A: Clear, Part B: Amber | Technical data sheet · p. 1 |
| Consistency | Pourable liquid | Technical data sheet · p. 1 |
| Viscosity (23°C) @ 50 rpm | 3,600 cPs | Technical data sheet · p. 1 |
| Glass Transition Temp | ≥ 90°C (Dynamic Cure: 20-200°C/ISO 25 Min; Ramp -10-200°C @20°C/Min) | Technical data sheet · p. 1 |
| Coefficient of Thermal Expansion (CTE) | Below Tg: 52 x 10-6 in/in°C, Above Tg: 185 x 10-6 in/in°C | Technical data sheet · p. 1 |
| Shore D Hardness | 85 | Technical data sheet · p. 1 |
| Lap Shear @ 23°C | > 2000 psi | Technical data sheet · p. 1 |
| Die Shear @ 23°C | 38 Kg; 32 Kg (after 7d @ 85°C / 85% RH); 15 Kg (after 2000h @ 85°C / 85% RH) | Technical data sheet · p. 1 |
| Storage Modulus | 2213 MPa @ 23°C | Technical data sheet · p. 1 |
| Thermal Conductivity | N/A | Technical data sheet · p. 2 |
| Volume Resistivity @ 23°C | ≥ 1.8 x 1013 Ohm-cm | Technical data sheet · p. 2 |
| Dielectric Constant (1KHz) | 3.17 | Technical data sheet · p. 2 |
| Dissipation Factor (1KHz) | 0.005 | Technical data sheet · p. 2 |
Manufacturer classification
| Brand | Epoxy Technology |
| Technology | Epoxy |
| Market | Medical |
| Function | Bonding |
Reported values are not independent test results. Original units and table wording are preserved. Extracted TDS rows can depend on the grade, component and source table headings; use the linked page to verify that context. Test methods, sample preparation and cure schedules may differ; consult the original TDS before making a performance comparison.
Selection & processing checks
Compare the complete resin–hardener system. A different hardener or cure schedule can change the cured properties.
- Is the stated ratio by weight or by volume?
- Do the thermal and mechanical values use the same cure schedule?
- Is the formulation designed for casting, bonding or encapsulation?
- Confirm the complete product designation, including any hardener, color or formulation suffix.
- Read the current SDS for handling, protective equipment, storage and disposal information.
Missing properties are not estimated. Similar values or shared application labels do not establish a drop-in replacement.
Other materials in this family
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|---|---|---|---|---|
| EpoxAcast™ 650 + 101 Hardener | Epoxy | 7,000 cps | 16 linked | |
| EpoxAcast™ 650 + 102 Hardener | Epoxy | 7,000 cps | 3 linked | |
| EpoxAcast™ 650 + HT Hardener | Epoxy | 5,000 cps | 19 linked | |
| EpoxAcast™ 650 BLACK + 101 Hardener | Epoxy | 7,000 cps | 16 linked |