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Epoxy

EPO-TEK® H20E

EPO-TEK® H20E is listed by Epoxy Technology as an epoxy adhesive / resin system. This record connects 22 reported fields with 3 manufacturer document links. Review the original technical data sheet for the applicable test conditions and processing instructions.

150°C / 1 HourManufacturer-reported
TwoManufacturer-reported
1:1Manufacturer-reported
Part A: 2.03 | Part B: 3.07 Syringe: 2.67Manufacturer-reported
2.5 DaysManufacturer-reported
One year at room temperatureManufacturer-reported

Technical & safety documents

3 links
Files open on the manufacturer's document host. Region and language follow the source listing; confirm the revision inside the file.
Open original PDF
SDS
EPO-TEK® H20E Safety Data SheetEnglish · Not specified
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SDS
EPO-TEK® H20E Safety Data Sheet SyringeEnglish · Not specified
Open file
TDS
EPO-TEK® H20EEnglish · Not specified
Open file

Reported specifications

22 fields
Material and processing data
PropertyReported valueEvidence
Recommended cure (source schedule)150°C / 1 HourTechnical data sheet · p. 1
No. of ComponentsTwoTechnical data sheet · p. 1
Mix Ratio by Weight1:1Technical data sheet · p. 1
Specific GravityPart A: 2.03 | Part B: 3.07 Syringe: 2.67Technical data sheet · p. 1
Pot Life2.5 DaysTechnical data sheet · p. 1
Shelf Life- BulkOne year at room temperatureTechnical data sheet · p. 1
Shelf Life- SyringeOne year at -40°CTechnical data sheet · p. 1
Color (before cure)Part A: Silver | Part B: SilverTechnical data sheet · p. 1
ConsistencySmooth thixotropic pasteTechnical data sheet · p. 1
Viscosity (23°C) @ 100 rpm2,200 - 3,200 cPsTechnical data sheet · p. 1
Glass Transition Temp≥ 80 °C (Dynamic Cure: 20-200°C/ISO 25 Min; Ramp -10-200°C @20°C/Min)Technical data sheet · p. 1
Shore D Hardness75Technical data sheet · p. 1
Lap Shear @ 23°C1,475 psiTechnical data sheet · p. 1
Die Shear @ 23°C≥ 10 Kg | 3,556 psiTechnical data sheet · p. 1
Storage Modulus808,700 psiTechnical data sheet · p. 1
Thermal Conductivity2.5 W/mK based on standard method: Laser FlashTechnical data sheet · p. 1
Volume Resistivity @ 23°C≤ 0.0004 Ohm-cmTechnical data sheet · p. 1
Manufacturer classification
BrandEpoxy Technology
TechnologyEpoxy
ApplicationConsumer Electronics and PCBA E-mobility Microelectronics/Semiconductors Off-shore Drilling Optical Sensors and Camera Modules Radar Systems, Navigation and Sensors Solar/Wind
MarketAerospace and Defense Automotive and Transportation Electronics Oil and Renewable Energy Optical, Datacom and Telecom
FunctionBonding Electrical Connection High Temperature Sealing Thermal Transfer
Reported values are not independent test results. Original units and table wording are preserved. Extracted TDS rows can depend on the grade, component and source table headings; use the linked page to verify that context. Test methods, sample preparation and cure schedules may differ; consult the original TDS before making a performance comparison.

Selection & processing checks

Compare the complete resin–hardener system. A different hardener or cure schedule can change the cured properties.

  • Is the stated ratio by weight or by volume?
  • Do the thermal and mechanical values use the same cure schedule?
  • Is the formulation designed for casting, bonding or encapsulation?
  • Confirm the complete product designation, including any hardener, color or formulation suffix.
  • Read the current SDS for handling, protective equipment, storage and disposal information.

Missing properties are not estimated. Similar values or shared application labels do not establish a drop-in replacement.

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