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Epoxy

EPO-TEK® EK1000

EPO-TEK® EK1000 is listed by Epoxy Technology as an epoxy adhesive / resin system. This record connects 29 reported fields with 2 manufacturer document links. Review the original technical data sheet for the applicable test conditions and processing instructions.

SingleManufacturer-reported
N/AManufacturer-reported
3.34Manufacturer-reported
2 Weeks | Dry Time: ≤ 1 DayManufacturer-reported
One year at -40°CManufacturer-reported
One year at -40°CManufacturer-reported

Technical & safety documents

2 links
Files open on the manufacturer's document host. Region and language follow the source listing; confirm the revision inside the file.
Open original PDF
TDS
epotek®English · Not specified
Open file
SDS
EPO-TEK® EK1000English · Not specified
Open file

Reported specifications

29 fields
Material and processing data
PropertyReported valueEvidence
No. of ComponentsSingleTechnical data sheet · p. 1
Mix Ratio by WeightN/ATechnical data sheet · p. 1
Specific Gravity3.34Technical data sheet · p. 1
Pot Life2 Weeks | Dry Time: ≤ 1 DayTechnical data sheet · p. 1
Shelf Life- BulkOne year at -40°CTechnical data sheet · p. 1
Shelf Life- SyringeOne year at -40°CTechnical data sheet · p. 1
Color (before cure)SilverTechnical data sheet · p. 1
ConsistencySmooth thixotropic pasteTechnical data sheet · p. 1
Viscosity (23°C) @ 100 rpm1,800 - 3,600 cPsTechnical data sheet · p. 1
Glass Transition Temp≥ 80 °C (Dynamic Cure: 20-300°C/ISO 25 Min; Ramp -10-200°C @20°C/Min)Technical data sheet · p. 1
Shore D Hardness66Technical data sheet · p. 1
Lap Shear @ 23°C1,010 psiTechnical data sheet · p. 1
Die Shear @ 23°C (Initial)≥ 10 Kg | 3,556 psiTechnical data sheet · p. 1
Die Shear @ 23°C (after 1000 hrs 85°C/85% RH)≥ 5 Kg | 1,778 psiTechnical data sheet · p. 1
Die Shear @ 23°C (125°C/2 Hours)≥ 5 Kg | 1,778 psiTechnical data sheet · p. 1
Storage Modulus273,528 psiTechnical data sheet · p. 1
Thermal Conductivity (150°C/1 Hour)12.6 | W/mKTechnical data sheet · p. 1
Thermal Conductivity (150°C/1 Hour + 200°C/1 Hour)26.3 | W/mKTechnical data sheet · p. 1
Thermal Conductivity (125°C/2.5 Hours+150°C/36 Min+ 200°C/15 Min)35.5 | W/mKTechnical data sheet · p. 1
Thermal Conductivity (125°C/2 Hours)5.56 | W/mKTechnical data sheet · p. 1
Volume Resistivity @ 23°C (150°C/1 Hour + 200°C/1 Hour)≤ 0.00009 | Ohm-cmTechnical data sheet · p. 1
Volume Resistivity @ 23°C (125°C/2 Hours)0.00007 | Ohm-cmTechnical data sheet · p. 1
Dielectric Constant (1KHz)N/ATechnical data sheet · p. 1
Dissipation Factor (1KHz)N/ATechnical data sheet · p. 1
Manufacturer classification
BrandEpoxy Technology
TechnologyEpoxy
ApplicationConsumer Electronics and PCBA Datacom and Telecom E-mobility Microelectronics/Semiconductors Off-shore Drilling Optical Sensors and Camera Modules Radar Systems, Navigation and Sensors Solar/Wind
MarketAutomotive and Transportation Electronics Oil and Renewable Energy Optical, Datacom and Telecom
FunctionBonding Electrical Connection High Temperature Sealing Thermal Transfer
Reported values are not independent test results. Original units and table wording are preserved. Extracted TDS rows can depend on the grade, component and source table headings; use the linked page to verify that context. Test methods, sample preparation and cure schedules may differ; consult the original TDS before making a performance comparison.

Selection & processing checks

Compare the complete resin–hardener system. A different hardener or cure schedule can change the cured properties.

  • Is the stated ratio by weight or by volume?
  • Do the thermal and mechanical values use the same cure schedule?
  • Is the formulation designed for casting, bonding or encapsulation?
  • Confirm the complete product designation, including any hardener, color or formulation suffix.
  • Read the current SDS for handling, protective equipment, storage and disposal information.

Missing properties are not estimated. Similar values or shared application labels do not establish a drop-in replacement.

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