Epoxy Technology / Material reference
EpoxyEPO-TEK® E4110-PFC
EPO-TEK® E4110-PFC is listed by Epoxy Technology as an epoxy adhesive / resin system. This record connects 19 reported fields with 2 manufacturer document links. Review the original technical data sheet for the applicable test conditions and processing instructions.
80°C / 3 HoursManufacturer-reported
TwoManufacturer-reported
3:1Manufacturer-reported
Part A: 3.26 | Part B: 3.97Manufacturer-reported
2 - 3 HoursManufacturer-reported
One year at room temperatureManufacturer-reported
Technical & safety documents
2 linksFiles open on the manufacturer's document host. Region and language follow the source listing; confirm the revision inside the file.
EPO-TEK® E4110-PFC TDSEnglish · Not specified
Open file EPO-TEK® E4110-PFC SDSEnglish · Not specified
Open file Reported specifications
19 fieldsMaterial and processing data
| Property | Reported value | Evidence |
|---|---|---|
| Recommended cure (source schedule) | 80°C / 3 Hours | Technical data sheet · p. 1 |
| No. of Components | Two | Technical data sheet · p. 1 |
| Mix Ratio by Weight | 3:1 | Technical data sheet · p. 1 |
| Specific Gravity | Part A: 3.26 | Part B: 3.97 | Technical data sheet · p. 1 |
| Pot Life | 2 - 3 Hours | Technical data sheet · p. 1 |
| Shelf Life- Bulk | One year at room temperature | Technical data sheet · p. 1 |
| Color (before cure) | Part A: Silver | Part B: Silver | Technical data sheet · p. 1 |
| Consistency | Smooth thixotropic paste | Technical data sheet · p. 1 |
| Viscosity (23°C) @ 5 rpm | 50,000-60,000 cPs | Technical data sheet · p. 1 |
| Glass Transition Temp | ≥ 40 °C (Dynamic Cure: 20-200°C/ISO 25 Min; Ramp -40-200°C @20°C/Min) | Technical data sheet · p. 1 |
| Shore D Hardness | 68 | Technical data sheet · p. 1 |
| Lap Shear @ 23°C | 1,250 | psi | Technical data sheet · p. 1 |
| Die Shear @ 23°C | ≥5 | Kg | 1,778 psi | Technical data sheet · p. 1 |
| Storage Modulus | 221,719 | psi | Technical data sheet · p. 1 |
| Thermal Conductivity | 1.6 | W/mK | Technical data sheet · p. 1 |
| Volume Resistivity @ 23°C | ≤ 0.005 | Ohm-cm | Technical data sheet · p. 1 |
Manufacturer classification
| Brand | Epoxy Technology |
| Technology | Epoxy |
| Market | Electronics |
Reported values are not independent test results. Original units and table wording are preserved. Extracted TDS rows can depend on the grade, component and source table headings; use the linked page to verify that context. Test methods, sample preparation and cure schedules may differ; consult the original TDS before making a performance comparison.
Selection & processing checks
Compare the complete resin–hardener system. A different hardener or cure schedule can change the cured properties.
- Is the stated ratio by weight or by volume?
- Do the thermal and mechanical values use the same cure schedule?
- Is the formulation designed for casting, bonding or encapsulation?
- Confirm the complete product designation, including any hardener, color or formulation suffix.
- Read the current SDS for handling, protective equipment, storage and disposal information.
Missing properties are not estimated. Similar values or shared application labels do not establish a drop-in replacement.
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