Epoxy Technology / Material reference
EpoxyEPO-TEK® 730-110
EPO-TEK® 730-110 is listed by Epoxy Technology as an epoxy adhesive / resin system. This record connects 24 reported fields with 2 manufacturer document links. Review the original technical data sheet for the applicable test conditions and processing instructions.
80°C / 2 HoursManufacturer-reported
TwoManufacturer-reported
1:1Manufacturer-reported
Part A: 1.17 | Part B: 0.97Manufacturer-reported
1 HourManufacturer-reported
One year at room temperatureManufacturer-reported
Technical & safety documents
2 linksFiles open on the manufacturer's document host. Region and language follow the source listing; confirm the revision inside the file.
EPO-TEK® 730-110 TDSEnglish · Not specified
Open file EPO-TEK® 730-110 SDSEnglish · Not specified
Open file Reported specifications
24 fieldsMaterial and processing data
| Property | Reported value | Evidence |
|---|---|---|
| Recommended cure (source schedule) | 80°C / 2 Hours | Technical data sheet · p. 1 |
| No. of Components | Two | Technical data sheet · p. 1 |
| Mix Ratio by Weight | 1:1 | Technical data sheet · p. 1 |
| Specific Gravity | Part A: 1.17 | Part B: 0.97 | Technical data sheet · p. 1 |
| Pot Life | 1 Hour | Technical data sheet · p. 1 |
| Shelf Life- Bulk | One year at room temperature | Technical data sheet · p. 1 |
| Color (before cure) | Part A: Clear/Colorless | Part B: Clear yellow | Technical data sheet · p. 1 |
| Consistency | Pourable liquid | Technical data sheet · p. 1 |
| Viscosity (23°C) @ 20 rpm | 8,000-12,000 cPs | Technical data sheet · p. 1 |
| Glass Transition Temp | ≥ 50 °C (Dynamic Cure: 20-200°C/ISO 25 Min; Ramp -10-200°C @20°C/Min) | Technical data sheet · p. 1 |
| Shore D Hardness | 76 | Technical data sheet · p. 1 |
| Lap Shear @ 23°C | > 2,000 | psi | Technical data sheet · p. 1 |
| Die Shear @ 23°C | ≥ 10 | Kg | 3,556 psi | Technical data sheet · p. 1 |
| Storage Modulus | 129,916 | psi | Technical data sheet · p. 1 |
| Thermal Conductivity | N/A | Technical data sheet · p. 1 |
| Volume Resistivity @ 23°C | ≥ 4 x 1012 | Ohm-cm | Technical data sheet · p. 1 |
| Dielectric Constant (1KHz) | 3.10 | Technical data sheet · p. 1 |
| Dissipation Factor (1KHz) | 0.008 | Technical data sheet · p. 1 |
| Refractive Index (uncured) | 1.5275 @ 589 | nm | Technical data sheet · p. 1 |
Manufacturer classification
| Brand | Epoxy Technology |
| Technology | Epoxy |
| Application | Consumer Electronics and PCBA Optical Sensors and Camera Modules |
| Market | Automotive and Transportation Electronics Optical, Datacom and Telecom |
| Function | Bonding Encapsulation General Purpose Potting and Encapsulation Sealing |
Reported values are not independent test results. Original units and table wording are preserved. Extracted TDS rows can depend on the grade, component and source table headings; use the linked page to verify that context. Test methods, sample preparation and cure schedules may differ; consult the original TDS before making a performance comparison.
Selection & processing checks
Compare the complete resin–hardener system. A different hardener or cure schedule can change the cured properties.
- Is the stated ratio by weight or by volume?
- Do the thermal and mechanical values use the same cure schedule?
- Is the formulation designed for casting, bonding or encapsulation?
- Confirm the complete product designation, including any hardener, color or formulation suffix.
- Read the current SDS for handling, protective equipment, storage and disposal information.
Missing properties are not estimated. Similar values or shared application labels do not establish a drop-in replacement.
Other materials in this family
View collection| Material / manufacturer | Family | Key specification | Documents | Add to comparison |
|---|---|---|---|---|
| EpoxAcast™ 650 + 101 Hardener | Epoxy | 7,000 cps | 16 linked | |
| EpoxAcast™ 650 + 102 Hardener | Epoxy | 7,000 cps | 3 linked | |
| EpoxAcast™ 650 + HT Hardener | Epoxy | 5,000 cps | 19 linked | |
| EpoxAcast™ 650 BLACK + 101 Hardener | Epoxy | 7,000 cps | 16 linked |