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Epoxy

EPO-TEK® 353ND

EPO-TEK® 353ND is listed by Epoxy Technology as an epoxy adhesive / resin system. This record connects 24 reported fields with 2 manufacturer document links. Review the original technical data sheet for the applicable test conditions and processing instructions.

150°C / 1 HourManufacturer-reported
TwoManufacturer-reported
10 : 1Manufacturer-reported
Part A: 1.20 | Part B: 1.02Manufacturer-reported
≤3 HoursManufacturer-reported
One year at room temperatureManufacturer-reported

Technical & safety documents

2 links
Files open on the manufacturer's document host. Region and language follow the source listing; confirm the revision inside the file.
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SDS
EPO-TEK® 353ND SDSEnglish · Not specified
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TDS
EPO-TEK® 353ND TDSEnglish · Not specified
Open file

Reported specifications

24 fields
Material and processing data
PropertyReported valueEvidence
Recommended cure (source schedule)150°C / 1 HourTechnical data sheet · p. 1
No. of ComponentsTwoTechnical data sheet · p. 1
Mix Ratio by Weight10 : 1Technical data sheet · p. 1
Specific GravityPart A: 1.20 | Part B: 1.02Technical data sheet · p. 1
Pot Life≤3 HoursTechnical data sheet · p. 1
Shelf Life- BulkOne year at room temperatureTechnical data sheet · p. 1
Color (before cure)Part A: Clear (Gardner < 5), Part B: Amber (Gardner 18 Typical)Technical data sheet · p. 1
ConsistencyPourable liquidTechnical data sheet · p. 1
Viscosity (23°C) @ 100 rpm3,000 - 5,000 cPsTechnical data sheet · p. 1
Glass Transition Temp≥ 90°C (Dynamic Cure: 20-200°C/ISO 25 Min; Ramp -10-200°C @20°C/Min)Technical data sheet · p. 1
Coefficient of Thermal Expansion (CTE)Below Tg: 54 x 10⁻6 in/in°C, Above Tg: 206 x 10⁻6 in/in°CTechnical data sheet · p. 1
Shore D Hardness85Technical data sheet · p. 1
Lap Shear @ 23°C> 2,000 psiTechnical data sheet · p. 1
Die Shear @ 23°C≥ 15 Kg (5,334 psi)Technical data sheet · p. 1
Storage Modulus508,298 psiTechnical data sheet · p. 1
Thermal ConductivityN/ATechnical data sheet · p. 2
Volume Resistivity @ 23°C≥ 1.8 x 10^13 Ohm-cmTechnical data sheet · p. 2
Dielectric Constant (1KHz)3.17Technical data sheet · p. 2
Dissipation Factor (1KHz)0.005Technical data sheet · p. 2
Manufacturer classification
BrandEpoxy Technology
TechnologyEpoxy
ApplicationE-mobility Microelectronics/Semiconductors Off-shore Drilling Optical Sensors and Camera Modules Radar Systems, Navigation and Sensors
MarketAerospace and Defense Automotive and Transportation Electronics Oil and Renewable Energy Optical, Datacom and Telecom
FunctionBonding Sealing
Reported values are not independent test results. Original units and table wording are preserved. Extracted TDS rows can depend on the grade, component and source table headings; use the linked page to verify that context. Test methods, sample preparation and cure schedules may differ; consult the original TDS before making a performance comparison.

Selection & processing checks

Compare the complete resin–hardener system. A different hardener or cure schedule can change the cured properties.

  • Is the stated ratio by weight or by volume?
  • Do the thermal and mechanical values use the same cure schedule?
  • Is the formulation designed for casting, bonding or encapsulation?
  • Confirm the complete product designation, including any hardener, color or formulation suffix.
  • Read the current SDS for handling, protective equipment, storage and disposal information.

Missing properties are not estimated. Similar values or shared application labels do not establish a drop-in replacement.

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