Epoxy Technology / Material reference
EpoxyEPO-TEK® 301-2
EPO-TEK® 301-2 is listed by Epoxy Technology as an epoxy adhesive / resin system. This record connects 25 reported fields with 3 manufacturer document links. Review the original technical data sheet for the applicable test conditions and processing instructions.
80°C / 3 HoursManufacturer-reported
TwoManufacturer-reported
100 : 35Manufacturer-reported
Part A: 1.15 | Part B: 0.95Manufacturer-reported
8 HoursManufacturer-reported
One year at room temperatureManufacturer-reported
Technical & safety documents
3 linksFiles open on the manufacturer's document host. Region and language follow the source listing; confirm the revision inside the file.
EPO-TEK® 301-2 TDSEnglish · Not specified
Open file EPO-TEK® 301-2 SDSEnglish · Not specified
Open file EPO-TEK® 301-2 Syringe SDSEnglish · Not specified
Open file Reported specifications
25 fieldsMaterial and processing data
| Property | Reported value | Evidence |
|---|---|---|
| Recommended cure (source schedule) | 80°C / 3 Hours | Technical data sheet · p. 1 |
| No. of Components | Two | Technical data sheet · p. 1 |
| Mix Ratio by Weight | 100 : 35 | Technical data sheet · p. 1 |
| Specific Gravity | Part A: 1.15 | Part B: 0.95 | Technical data sheet · p. 1 |
| Pot Life | 8 Hours | Technical data sheet · p. 1 |
| Shelf Life- Bulk | One year at room temperature | Technical data sheet · p. 1 |
| Shelf Life- Syringe | Six months at -40°C | Technical data sheet · p. 1 |
| Color (before cure) | Part A: Clear/Colorless | Part B: Clear/Colorless | Technical data sheet · p. 1 |
| Consistency | Pourable liquid | Technical data sheet · p. 1 |
| Viscosity (23°C) @ 100 rpm | 225 - 425 cPs | Technical data sheet · p. 1 |
| Glass Transition Temp | ≥ 80 °C (Dynamic Cure: 20-200°C/ISO 25 Min; Ramp -10-200°C @20°C/Min) | Technical data sheet · p. 1 |
| Shore D Hardness | 80 | Technical data sheet · p. 1 |
| Lap Shear @ 23°C | > 2,000 | psi | Technical data sheet · p. 1 |
| Die Shear @ 23°C | ≥ 15 | Kg | 5,334 psi | Technical data sheet · p. 1 |
| Storage Modulus | 432,279 | psi | Technical data sheet · p. 1 |
| Thermal Conductivity | N/A | Technical data sheet · p. 1 |
| Volume Resistivity @ 23°C | ≥ 2 x 1012 | Ohm-cm | Technical data sheet · p. 1 |
| Dielectric Constant (1KHz) | 3.80 | Technical data sheet · p. 1 |
| Dissipation Factor (1KHz) | 0.012 | Technical data sheet · p. 1 |
| Refractive Index | 1.5318 @ 589 | nm | Technical data sheet · p. 1 |
Manufacturer classification
| Brand | Epoxy Technology |
| Technology | Epoxy |
| Application | Datacom and Telecom E-mobility Microelectronics/Semiconductors Optical Sensors and Camera Modules |
| Market | Automotive and Transportation Electronics Optical, Datacom and Telecom |
| Function | Bonding Glob-Top Sealing Underfill |
Reported values are not independent test results. Original units and table wording are preserved. Extracted TDS rows can depend on the grade, component and source table headings; use the linked page to verify that context. Test methods, sample preparation and cure schedules may differ; consult the original TDS before making a performance comparison.
Selection & processing checks
Compare the complete resin–hardener system. A different hardener or cure schedule can change the cured properties.
- Is the stated ratio by weight or by volume?
- Do the thermal and mechanical values use the same cure schedule?
- Is the formulation designed for casting, bonding or encapsulation?
- Confirm the complete product designation, including any hardener, color or formulation suffix.
- Read the current SDS for handling, protective equipment, storage and disposal information.
Missing properties are not estimated. Similar values or shared application labels do not establish a drop-in replacement.
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| EpoxAcast™ 650 BLACK + 101 Hardener | Epoxy | 7,000 cps | 16 linked |