Epoxies, Etc. / Material reference
Epoxy50-3112
50-3112 is listed by Epoxies, Etc. as an epoxy adhesive / resin system. This record connects 10 reported fields with 4 manufacturer document links. Review the original technical data sheet for the applicable test conditions and processing instructions.
15 minutesManufacturer-reported
1:1Manufacturer-reported
440Manufacturer-reported
5.3Manufacturer-reported
2.4 x 1012Manufacturer-reported
1.04Manufacturer-reported
Technical & safety documents
4 linksFiles open on the manufacturer's document host. Region and language follow the source listing; confirm the revision inside the file.
50-3112RBK SDSEnglish · Not specified
Open file 50-3112CWH SDSEnglish · Not specified
Open file T50-3112GR TriggerBond® SDSEnglish · Not specified
Open file 50-3112 TDSEnglish · Not specified
Open file Reported specifications
10 fieldsMaterial and processing data
| Property | Reported value | Evidence |
|---|---|---|
| Gel Time, Minutes, 15 grams, 25 °C | 15 minutes | Technical data sheet · p. 1 |
| Mix Ratio, By Volume | 1:1 | Technical data sheet · p. 1 |
| Dielectric Strength, V/mil | 440 | Technical data sheet · p. 2 |
| Dielectric Constant, 25 °C, 100Hz | 5.3 | Technical data sheet · p. 2 |
| Volume Resistivity, ohm-cm, 25 °C | 2.4 x 1012 | Technical data sheet · p. 2 |
| Thermal Conductivity, W/m∙ °K | 1.04 | Technical data sheet · p. 2 |
Manufacturer classification
| Brand | Epoxies, Etc. |
| Technology | Epoxy |
| Application | Consumer Electronics and PCBA |
| Market | Aerospace and Defense Automotive and Transportation Electronics |
Reported values are not independent test results. Original units and table wording are preserved. Extracted TDS rows can depend on the grade, component and source table headings; use the linked page to verify that context. Test methods, sample preparation and cure schedules may differ; consult the original TDS before making a performance comparison.
Selection & processing checks
Compare the complete resin–hardener system. A different hardener or cure schedule can change the cured properties.
- Is the stated ratio by weight or by volume?
- Do the thermal and mechanical values use the same cure schedule?
- Is the formulation designed for casting, bonding or encapsulation?
- Confirm the complete product designation, including any hardener, color or formulation suffix.
- Read the current SDS for handling, protective equipment, storage and disposal information.
Missing properties are not estimated. Similar values or shared application labels do not establish a drop-in replacement.
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|---|---|---|---|---|
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