Epoxies, Etc. / Material reference
Epoxy50-3170
50-3170 is listed by Epoxies, Etc. as an epoxy adhesive / resin system. This record connects 16 reported fields with 4 manufacturer document links. Review the original technical data sheet for the applicable test conditions and processing instructions.
BlackManufacturer-reported
90Manufacturer-reported
100:4Manufacturer-reported
3 HoursManufacturer-reported
24 HoursManufacturer-reported
1.90Manufacturer-reported
Technical & safety documents
4 linksFiles open on the manufacturer's document host. Region and language follow the source listing; confirm the revision inside the file.
50-3170 TDSEnglish · Not specified
Open file 50-3170RBK SDSEnglish · Not specified
Open file 50-3170CCL SDSEnglish · Not specified
Open file F50-3170BK SDSEnglish · Not specified
Open file Reported specifications
16 fieldsMaterial and processing data
| Property | Reported value | Evidence |
|---|---|---|
| Color | Black | Technical data sheet · p. 1 |
| Hardness, Shore A | 90 | Technical data sheet · p. 1 |
| Mix Ratio, Resin:Catalyst, by Weight | 100:4 | Technical data sheet · p. 1 |
| Pot Life, 100-gram Mass, 25 °C | 3 Hours | Technical data sheet · p. 1 |
| Gel Time | 24 Hours | Technical data sheet · p. 1 |
| Specific Gravity, 25 °C | 1.90 | Technical data sheet · p. 1 |
| Elongation at Failure, % | 24 | Technical data sheet · p. 1 |
| Dielectric Strength, V/mil | 480 | Technical data sheet · p. 1 |
| Dielectric Constant, 60 Hz | 3.4 | Technical data sheet · p. 1 |
| Dissipation Factor, 60 Hz | 0.2 | Technical data sheet · p. 1 |
| Volume Resistivity, ohm-cm, 25 °C | 1.5 x 1014 | Technical data sheet · p. 1 |
| Thermal Conductivity, W/m∙°K | 1.73 | Technical data sheet · p. 1 |
Manufacturer classification
| Brand | Epoxies, Etc. |
| Technology | Epoxy |
| Application | Consumer Electronics and PCBA E-mobility |
| Market | Automotive and Transportation Electronics |
Reported values are not independent test results. Original units and table wording are preserved. Extracted TDS rows can depend on the grade, component and source table headings; use the linked page to verify that context. Test methods, sample preparation and cure schedules may differ; consult the original TDS before making a performance comparison.
Selection & processing checks
Compare the complete resin–hardener system. A different hardener or cure schedule can change the cured properties.
- Is the stated ratio by weight or by volume?
- Do the thermal and mechanical values use the same cure schedule?
- Is the formulation designed for casting, bonding or encapsulation?
- Confirm the complete product designation, including any hardener, color or formulation suffix.
- Read the current SDS for handling, protective equipment, storage and disposal information.
Missing properties are not estimated. Similar values or shared application labels do not establish a drop-in replacement.
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